Semiconductor device and method of manufacturing the same
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United States of America Patent
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Apr 5, 2005
Grant Date -
Sep 26, 2002
app pub date -
Mar 7, 2002
filing date -
Mar 22, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut trace portion is formed on a side face extending along a first side of the main surface of the resin seal member. A sectional area of an area between the main surface of the wiring substrate and the main surface of the resin seal member at a position outside a side face of the semiconductor chip is smaller than a sectional area of an area between the main surface of the semiconductor chip and the main surface of the resin seal member.
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