Confocal 3D inspection system and process
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United States of America Patent
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Mar 22, 2005
Grant Date -
Mar 20, 2003
app pub date -
Feb 11, 2002
filing date -
Feb 9, 2001
priority date (Note) -
Expired
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Abstract
A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response.
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