Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings
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United States of America Patent
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Mar 15, 2005
Grant Date -
Aug 21, 2003
app pub date -
Feb 21, 2002
filing date -
Feb 21, 2002
priority date (Note) -
Expired
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Abstract
An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications. The process includes steps of depositing a radially-layered dendritic copolymer on selected surfaces of a dielectric substrate; cross-linking the radially-layered dendritic copolymer to form a dendritic polymer network; sorbing metal cations into the cross-linked dendritic polymer network; reducing the metal cations to form a nanocomposite composition exhibiting adequate surface electrical conductivity for electroplating; and electroplating a metal onto the nanocomposite composition to form an electrically conductive deposit.
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