Wet cleaning process and wet cleaning equipment
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United States of America Patent
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Mar 15, 2005
Grant Date -
Mar 28, 2002
app pub date -
Aug 6, 2001
filing date -
Aug 9, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wet treatment method useful in one of a chemical processing and a rinsing step performed upon fabrication of semiconductor devices. A substrate is treated with a desired liquid while revolving the substrate around an axis of rotation outside the substrate such that the liquid flowing on a surface of the substrate is maintained flowing under a centrifugal force greater than gravitation. The substrate is treated while supplying the liquid at a flow rate at least equal to a discharge rate of the liquid only in a direction conforming with that of the centrifugal force or with that of a flow of the liquid flowing on the surface of the substrate under the centrifugal force. The substrate surface is evenly treated with the liquid while avoiding flows of the liquid running against each other or a flow of the liquid stagnating on the surface of the substrate.
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