Method of backgrinding wafers while leaving backgrinding tape on a chuck
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United States of America Patent
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Mar 15, 2005
Issued Date -
N/A
app pub date -
Dec 10, 2002
filing date -
Sep 27, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.
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