Flexible circuit board
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United States of America Patent
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Mar 15, 2005
Issued Date -
N/A
app pub date -
Mar 28, 2003
filing date -
Apr 25, 2001
priority date (Note) -
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Abstract
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.
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