Two component, curable, hot melt adhesive
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United States of America Patent
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Mar 1, 2005
Grant Date -
Jan 22, 2004
app pub date -
Jul 19, 2002
filing date -
Jul 19, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
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