Package for integrated circuit with thermal vias and method thereof
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United States of America Patent
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Mar 1, 2005
Issued Date -
N/A
app pub date -
Nov 6, 2003
filing date -
May 28, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for enhancing thermal performance of an integrated circuit package attaches a dummy die to the semiconductor die of the integrated circuit. The dummy die is then thermally coupled through external terminals to the conductive layers of a printed circuit board. In one embodiment, the integrated circuit package includes an insulating substrate on which the dummy die is attached. Conductive vias thermally connect conductive terminals provided on one side of the insulating substrate to conductive terminals provided on the other side of the insulating substrate. In one embodiment, the integrated circuit package is provided as a ball grid array (BGA) package. In addition, multiple layers of conductors can be provided in both the insulating substrate of the integrated circuit and in the external printed circuit board.
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