Test fixture for semiconductor package and test method of using the same

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United States of America Patent

PATENT NO 6859056
APP PUB NO 20030151420A1
SERIAL NO

10176147

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Abstract

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A test fixture for semiconductor packages and a test method of using the test fixture are proposed. The test fixture is composed of a circuit board, an interposer and a covering member. The circuit board is used to accommodate semiconductor packages and electrically connect the semiconductor packages to a test device. The interposer is mounted on the circuit board, and formed with through holes for receiving the semiconductor packages therein. The covering member is attached onto the interposer, and provided with elastic mechanisms for holding the semiconductor packages in position. By using the test fixture, semiconductor packages can be firmly coupled to the test device where functional tests are performed.

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Patent Owner(s)

Patent OwnerAddress
UTAC HEADQUARTERS PTE LTD22 ANG MO KIO INDUSTRIAL PARK 2 SINGAPORE 569506

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bai, Jin-Chuan Hsinchu, TW 15 115
Lu, Soon-Aik Hsinchu, TW 3 4
Su, Huan-Ping Hsinchu, TW 16 119

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