Process for producing printed circuits and printed circuits thus obtained
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United States of America Patent
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Feb 22, 2005
Grant Date -
May 16, 2002
app pub date -
Jan 9, 2002
filing date -
Feb 17, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to the conductive track. There is a provision to apply the auxiliary conductive element by means of an apparatus for applying SMD components.
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