Electronic part with a lead frame
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United States of America Patent
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Feb 22, 2005
Grant Date -
May 20, 2004
app pub date -
Oct 1, 2003
filing date -
Apr 13, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component comprises an upper half housing segment and a lower half housing segment. A lead frame to be bent downward toward the lower housing segment projects laterally from an upper end portion of the lower housing segment. Projecting from a side wall upper end portion of the lower housing segment is a rib piece in contact with the lower surface of base end portion of the lead frame and plastically deformable when subjected to a bending force to be applied to the base end portion when the lead frame is bent.
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