Releasable adhesive for attachments of substrates and joints
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United States of America Patent
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Feb 22, 2005
Grant Date -
N/A
app pub date -
Nov 20, 2000
filing date -
Nov 24, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hot-melt adhesive contains a non-pressure-sensitive adhesive that is fluid at application temperatures and that is removable, residue-free, by peeling at small peel angles. The adhesive contains additives selected from the group consisting of fillers, stabilizers, dyes, carbon black, and moisture absorbents. The adhesive also containing the following: a) thermoplastic elastomers that may be grafted, b) grafted and poly-.alpha.-olefins, c) polyisobutylene or a softening oil, d) adhesive resin, and e) end block resin.
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