High frequency semiconductor device

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United States of America Patent

PATENT NO 6853054
APP PUB NO 20020140057A1
SERIAL NO

10078346

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Abstract

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A high frequency semiconductor device including wiring layers which are formed above a semiconductor substrate and in which transmission lines are formed by combining with a ground plate having a potential fixed at the ground potential, at least one crossing portion in which the wiring layers mutually cross, with insulating interlayers provided therebetween, and at least one separation electrode being selectively provided on one of the insulating interlayers, the at least one separation electrode having a potential fixed at the ground potential. Accordingly, in the high frequency semiconductor device, electrical interference between two crossing wiring layer is prevented and transmission loss is suppressed.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU QUANTUM DEVICES LIMITED1000 OAZA KAMISUKIAWARA SHOWA-CHO NAKAKOMA-GUN YAMANASHI 409-3883

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baba, Osamu Yamanashi, JP 19 125
Mimino, Yutaka Yamanashi, JP 15 116

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