Thin metal package and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 8, 2005
Grant Date -
Oct 21, 2004
app pub date -
Mar 26, 2004
filing date -
Oct 18, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material arranged at an internal space of the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface of the metal lead that is positioned at the internal space of the metal base. The internal space is held at an air-tight atmosphere. The metal lead forms a surface for attaching the metal base to a mounting board. An insulation distance between the metal lead and the metal base is at least 0.05 mm and at most 0.3 mm.
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