Method of reducing particulate contamination during polishing of a wafer
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United States of America Patent
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Feb 1, 2005
Grant Date -
Oct 9, 2003
app pub date -
Apr 5, 2002
filing date -
Apr 5, 2002
priority date (Note) -
Expired
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Abstract
A method of polishing the surface of a semiconductor wafer such that the adherence of abrasive particles to the surface of the wafer is minimized, resulting in a semiconductor wafer having a reduced number of pits. The invented method has two stages. The first stage follows traditional polishing practice using chemical mechanical polishing. The second stage diverges from traditional practices and provides for a final polishing step or steps involving the polishing of the wafer with a polishing solution having no abrasive particles.
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