Process for manufacturing flexible wiring boards
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United States of America Patent
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Feb 1, 2005
Grant Date -
Mar 11, 2004
app pub date -
Aug 14, 2003
filing date -
Jul 29, 1998
priority date (Note) -
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Abstract
A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.
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