Apparatus and method for measuring the temperature of substrates
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United States of America Patent
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Jan 25, 2005
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N/A
app pub date -
Nov 16, 2001
filing date -
Feb 10, 1999
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Abstract
The invention relates to a device for measuring the temperature of substrates, notably semiconductor wafers. The device comprises at least one radiation sensor for measuring the radiation emitted by the substrate and an element (19) which restricts the field of vision of the radiation sensor and is positioned between the substrate and the radiation sensor. The substrate temperature can be determined correctly and simply, even if the substrate vibrates or is tilting, owing to the fact that the edges (20) of the element extend in a straight line. The invention also relates to a corresponding method.
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