Traceless flip chip assembly and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 25, 2005
Issued Date -
N/A
app pub date -
Apr 11, 2003
filing date -
Feb 26, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for forming a fine-pitch flip chip assembly interconnects fine pitch devices after they have been connected to a carrier substrate. A die having a plurality of conductive sections, such as solder balls, is attached to a conductive layer of the substrate. An interconnect pattern is then formed in the conductive layer to connect the conductive sections and generate electronic functionality to the assembly. By forming the interconnect pattern after the device have been connected to the carrier, the invention provides precise alignment between the devices and the interconnect pattern without actually aligning the two components during the assembly process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully