Multilayer film structures having improved seal and tear properties

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United States of America Patent

PATENT NO 6846551
APP PUB NO 20020086174A1
SERIAL NO

09470386

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer film structure having at least two layers wherein the first layer comprises poly(ethylene) having a density range from about 0.93 g/cc to 0.97 g/cc; and a second layer comprising poly(ethylene) having a density range from 0.89 g/cc to 0.93 g/cc wherein the second layer is capable of forming a heat seal. The multilayer film structure is capable of being laminated to another film structure or a packaging film component. The packages of the present invention are useful for the packaging of flowable materials.

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Patent Owner(s)

Patent OwnerAddress
BEMIS COMPANY INC134 E WISCONSIN AVENUE ONE NEENAH CENTER 4TH FLOOR NEENAH WI 54956

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Duffy, Erin M Appleton, WI 36 176
Gehrke, Russell P Menasha, WI 10 650
Genske, Roger P Neenah, WI 22 1038

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