Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
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United States of America Patent
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Jan 25, 2005
Grant Date -
Aug 1, 2002
app pub date -
Oct 24, 2001
filing date -
Nov 29, 2000
priority date (Note) -
Expired
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Abstract
The present invention is directed, in general, to a method of polishing a surface on substrates, such as semiconductor wafers and, more specifically, to a polishing pad suitable for this purpose. The polishing pad comprises a polishing body that includes a cross-linked polymer material, and may be incorporated into a polishing apparatus. Polishing includes positioning the substrate containing at least one layer against the polishing body and polishing the layer.
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