Shock absorber for a power wheelchair
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 25, 2005
Grant Date -
Sep 9, 2004
app pub date -
Mar 5, 2003
filing date -
Mar 5, 2003
priority date (Note) -
Expired
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
A shock absorber is installed in a power wheelchair to absorb shocks transmitted from rear wheels of the power wheelchair. The shock absorber includes a bracket, a seat and a suspension device. The suspension device is installed between the bracket and the seat and includes two suspension springs. Each suspension spring has a different spring stiffness. The seat is pivotally connected to the bracket at a pivot point between the two suspension springs. Consequently, the suspension springs will balance absorbing shocks caused by bumps while the power wheelchair is moving.
First Claim
all claims..Other Claims data not available
Family
- No Family data available.
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MERITS HEALTH PRODUCTS CO LTD | NO 18 JINGKE RD NANTUN DIST TAICHUNG CITY 408018 |
International Classification(s)

- 2003 Application Filing Year
- B60G Class
- 260 Applications Filed
- 99 Patents Issued To-Date
- 38.08 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Cheng, Ming-Chuan | Taichung, TW | 37 | 441 |
# of filed Patents : 37 Total Citations : 441 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 3 Citation Count
- B60G Class
- 1.97 % this patent is cited more than
- 20 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Apr 04, 2022 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Apr 04, 2022 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Feb 27, 2022 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Feb 27, 2022 |
Oct 18, 2021 | FEPP | FEE PAYMENT PROCEDURE | free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Feb 27, 2018 | I | Issuance | |
Feb 07, 2018 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Mar 16, 2017 | P | Published | |
Aug 26, 2016 | F | Filing | |
Aug 23, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAGO, HIROMITSU;SHIMADA, TAKANOBU;REEL/FRAME:039556/0765 Owner name: AUTONETWORKS TECHNOLOGIES, LTD., JAPAN Effective Date: Aug 23, 2016 free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAGO, HIROMITSU;SHIMADA, TAKANOBU;REEL/FRAME:039556/0765 Owner name: SUMITOMO WIRING SYSTEMS, LTD., JAPAN Effective Date: Aug 23, 2016 free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAGO, HIROMITSU;SHIMADA, TAKANOBU;REEL/FRAME:039556/0765 Owner name: SUMITOMO ELECTRIC INDUSTRIES, LTD., JAPAN Effective Date: Aug 23, 2016 |
Sep 16, 2015 | PD | Priority Date |

Matter Detail

Renewals Detail
