Substrates for powder deposition containing conductive domains
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United States of America Patent
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Jan 18, 2005
Grant Date -
Jan 16, 2003
app pub date -
Jul 11, 2001
filing date -
Jul 11, 2001
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Abstract
Provided is, among other things, a conductive inlay film comprising: a layer of dielectric film having a pattern of holes suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element comprising polymer, which element comprises (a) a conductive film laminated against the dielectric film or (b) a conductive film embedded within the holes, the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element is adapted to contact one or more electrode pads and provide electrical potentials at the selected regions, and wherein the dielectric film electrically isolates the selected regions.
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