Substrates for powder deposition containing conductive domains

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6844048
APP PUB NO 20030012926A1
SERIAL NO

09903394

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is, among other things, a conductive inlay film comprising: a layer of dielectric film having a pattern of holes suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element comprising polymer, which element comprises (a) a conductive film laminated against the dielectric film or (b) a conductive film embedded within the holes, the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element is adapted to contact one or more electrode pads and provide electrical potentials at the selected regions, and wherein the dielectric film electrically isolates the selected regions.

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Patent Owner(s)

Patent OwnerAddress
SARNOFF CORPORATIONN201 WASHINGTON ROAD CN 5300 PRINCETON NJ 08543

International Classification(s)

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  • 2001 Application Filing Year
  • B05D Class
  • 1794 Applications Filed
  • 511 Patents Issued To-Date
  • 28.49 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2001200220032004200520062007200820092010201120122013201420150255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jen-Chi Morrisville, PA 43 421
Chrai, Suggy S Cranbury, NJ 13 113
Murari, Ramaswamy Hillsborough, NJ 12 181

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Patent Citation Ranking

  • 1 Citation Count
  • B05D Class
  • 4.43 % this patent is cited more than
  • 20 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3645017579261684334801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475

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