Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals
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United States of America Patent
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Jan 18, 2005
Grant Date -
Jan 16, 2003
app pub date -
Jul 8, 2002
filing date -
Jul 11, 2001
priority date (Note) -
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Abstract
A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.
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