Wafer polishing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6840845
APP PUB NO 20030096564A1
SERIAL NO

10295887

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The wafer polishing apparatus enables the control of proper polishing pressure, so that the quality of wafers can be maintained high. A wafer holding head is composed of a carrier for pressing the wafer against a polishing pad, a retainer ring at the circumference of the carrier, and a holding head body. The holding head body includes a carrier pressing device having an air bag of which pressing surface area is 50% or smaller of the area of the wafer, and the pressing force from the carrier pressing device is transmitted to the carrier.

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Patent Owner(s)

Patent OwnerAddress
TOKYO SEIMITSU CO LTD2968-2 ISHIKAWA-MACHI HACHIOJI-CITY TOKYO 1928515 ?1928515

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Numoto, Minoru Tokyo, JP 23 266

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