Apparatus for mounting semiconductor chips
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United States of America Patent
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-
Jan 11, 2005
Grant Date -
Mar 14, 2002
app pub date -
Sep 12, 2001
filing date -
Sep 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.
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