Chip-packaging substrate
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United States of America Patent
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-
Jan 4, 2005
Grant Date -
Apr 24, 2003
app pub date -
Aug 26, 2002
filing date -
Oct 18, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A chip-packaging substrate. The substrate is capable of reducing damage during packaging, shrinking its connecting portions so that the length of any of the gap slots between the packaging portion and the frame portion of the substrate is increased. Furthermore, a dummy layer is provided to one surface of the frame portion to flush the surface on the frame portion with that of the packaging portion as much as possible.
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