Polishing pad resistant to delamination
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United States of America Patent
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Jan 4, 2005
Grant Date -
Jul 29, 2004
app pub date -
Mar 27, 2003
filing date -
Sep 11, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides, chemical mechanical polishing pad with improved polishing properties and longevity for polishing semiconductor wafers. The polishing pad comprises a thermoplastic backing film and a pressure sensitive adhesive coupled to the thermoplastic backing film. The pressure sensitive adhesive is configured to couple a chemical mechanical polishing pad to a polishing platen. The pressure sensitive adhesive is further configured to provide an interface capable of substantially preventing delamination of the polishing pad from the polishing platen for at least about 4 days exposure to a polishing slurry medium having a pH of about 4 or higher.
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