Methods and apparatus for electropolishing metal interconnections on semiconductor devices
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United States of America Patent
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Jan 4, 2005
Grant Date -
Oct 24, 2002
app pub date -
Apr 10, 2002
filing date -
Jul 9, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.
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