Method of patterning a substrate
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United States of America Patent
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Dec 28, 2004
Issued Date -
N/A
app pub date -
Feb 21, 2002
filing date -
Oct 25, 2001
priority date (Note) -
Expired
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Abstract
A method of patterning a substrate includes forming a liquid film on the substrate surface and directing laser energy from a laser through the film to etch the substrate surface. Etched material is carried away from the substrate surface via evaporation of the film during the etching. The liquid film may be formed on the substrate surface by jetting a liquid vapor onto the substrate.
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