Adhesive for semiconductor part
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 21, 2004
Grant Date -
N/A
app pub date -
Jan 4, 2000
filing date -
Jul 4, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.
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