Solvent-free two-component curable adhesive composition

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United States of America Patent

PATENT NO 6833044
APP PUB NO 20020157789A1
SERIAL NO

10082216

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Abstract

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The solvent-free two-component adhesive composition of the present invention is prepared by a polyol component (A) and a polyisocyanate component (B), wherein the composition comprises at least one polyol component having crystallinity and selected from the group consisting of a polyester polyol, a polyether polyol, a polycarbonate polyol and a polyurethane polyol in an amount of 3 to 50% by weight relative to the total weight of the components (A) and (B). The adhesive composition has the initial viscosity of about 100 to 1,500 mPa.multidot.s (in particular, 100 to 1,000 mPa.multidot.s) at 70.degree. C. immediately after the components (A) and (B) are mixed together, and the increasing ratio of viscosity after the composition is stood at 70.degree. C. for 10 minutes to the initial viscosity of 120% or less. According to the present invention, a composite laminated film having the good external appearance can be produced simply and effectively.

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Patent Owner(s)

Patent OwnerAddress
MITSUI TAKEDA CHEMICALS INCTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imai, Akihiro Osaka, JP 84 1230
Imamura, Kazuaki Osaka, JP 2 31
Morimoto, Taiji Osaka, JP 51 646

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