Cooler for electronic device
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United States of America Patent
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Dec 21, 2004
Grant Date -
N/A
app pub date -
Nov 8, 2001
filing date -
Feb 26, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
This is a cooler for dissipating heat away from an electronic device (A). The cooler includes a liquid cooling mechanism (B), a forcible air cooling mechanism (C) and a substrate (D). The liquid cooling mechanism includes a set of metal pipes (20-21) connected to a pump (3) with an impeller (16) to transfer cooling liquid to a liquid channel (4). The forcible air cooling mechanism (C) includes a fan (25) discharging air onto a radiating fin (37) located on the set of metal pipes (20-21). The substrates (D) is in fluid communication with the forcible air cooling mechanism (C) and the liquid cooling mechanism (B) and in direct contact with the electronic device (A) so as to remove heat away from the electronic device (A).
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