Method for separating substrate and thin-film layer of optical recording memory media using ultrasonic
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United States of America Patent
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Dec 14, 2004
Grant Date -
Dec 25, 2003
app pub date -
Jun 10, 2003
filing date -
Jun 20, 2002
priority date (Note) -
Expired
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Abstract
A method for separating a substrate and a thin-film material of an optical recording memory media using ultrasonic includes steps of placing an optical recording memory media in an ultrasonic environment and using ultrasonic to damage weaker interconnected interfaces of the optical recording memory media, thereby enabling the interconnected interfaces to absorb energies for attenuating or losing adhesive forces thereof with other layers. The entire method has simple operations, authentically completes the separation, facilitates high quality recycling of substrates and thin-film materials of optical recording memory media s, and effectively avoids possible re-contamination during the recycling process.
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