Polyimide substrates having an interpenetrating network morphology and methods relating thereto
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United States of America Patent
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Dec 7, 2004
Grant Date -
Dec 25, 2003
app pub date -
Dec 30, 2002
filing date -
Jun 24, 2002
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Abstract
A high modulus, dimensionally stable film formed via an interpenetrating polyimide network of two polyimide structures, interlocked and bonded on a molecular level. The polyimide components are made from a dianhydride and a diamine. The dianhydrides used are tetravalent aromatic structures represented by ##STR1## where X is a divalent organic group selected from among --CO--, --O--, --S--, --SO.sub.2 --, --CH.sub.2 --, --C(CH.sub.3).sub.2 --, and --C(CF.sub.3).sub.2 -- and diamines used are divalent aromatic structure represented by ##STR2## wherein Y is a divalent organic group selected from the group consisting of --CO--, --O--, --S--, --SO.sub.2 --, --CH.sub.2 --, --C(CH.sub.3).sub.2 --, and --C(CF.sub.3).sub.2 --. The end capping agent is a carboxylic anhydride or a silylating agent. The second polyimide is polymerized in the presence of the first polymer thus forming a single phase system.
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