Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules
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United States of America Patent
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-
Nov 30, 2004
Grant Date -
Feb 5, 2004
app pub date -
Aug 1, 2002
filing date -
Aug 1, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A frame structure for a T/R tile module configured to transmit and receive electromagnetic radiation over a predetermined portion of the electromagnetic spectrum is provided. The frame component comprises at least one frame component formed as a single piece from a synthetic resin dielectric material. The frame component is configured to support a plurality of electrical connectors, and has a thin film coating configured to provide a ground connection and electromagnetic shield when the frame structure is incorporated into a transmit/receive module. A portion of the frame component is configured to interface with a portion of a T/R module when the frame component is incorporated into the T/R module, and the synthetic resin dielectric material provides the frame component with a range of compressibility that enables the frame component to provide the module with an effective ground connection over that range of compressibility.
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