Test method for characterizing currents associated with powered components in an electronic system
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United States of America Patent
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Nov 30, 2004
Grant Date -
Oct 16, 2003
app pub date -
Apr 12, 2002
filing date -
Apr 12, 2002
priority date (Note) -
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Abstract
A test method characterizes current behavior of power components (e.g., semiconductor packages) within an electronic system. One or more electrically conductive loops are formed with a first printed circuit board of the electronic system; these loops surround, at least in part, one or more electrical vias of the first printed circuit board. One or more power components connect to the vias to obtain power therethrough. Current characteristics are measured from one or more vias to assess transient and steady-state currents of components within the system. Power dissipation may be determined from the current. The loops may be formed within tracks of internal layers of the first printed circuit board, or a second printed circuit board may form the tracks.
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