Mold cap anchoring method for molded flex BGA packages
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United States of America Patent
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Nov 30, 2004
Grant Date -
Jun 10, 2004
app pub date -
Dec 10, 2002
filing date -
Dec 10, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A new method is provided for the creation of a mold cap. The mold cap anchoring feature of the invention is designed and incorporated from the start of the design and fabrication of the substrate. Various design options of the mold anchor of the invention can be implemented. The mold anchor of the invention allows the mold compound to flow underneath the substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities surrounding and being accessible from the mold anchor of the invention where the mold compound will remain in place and harden. After hardening, the mold compound surrounding the mold anchor will support the anchored area.
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