Self-shadowing MEM structures
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United States of America Patent
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Nov 30, 2004
Grant Date -
Sep 18, 2003
app pub date -
Mar 15, 2002
filing date -
Mar 15, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad (10) configured for shadowing an exposed end (44A) of a shielded interconnect line (44) connected to the bond pad (10) from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas (42, 72, 92) patterned from respective first, second and third layers (40, 70, 90) of material deposited on a substrate (20). The exposed end (44A) of the interconnect line (44) abuts an edge of the first bond pad area (42). The third bond pad area (92) includes at least one tab portion (94) extending laterally from an edge of the third bond pad area (92) to shadow an area on the substrate (20) including the exposed end (44A) of the interconnect line (44) abutting the edge of the first bond pad area (42).
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