Method for designing application specific integrated circuit structure
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United States of America Patent
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Nov 23, 2004
Grant Date -
N/A
app pub date -
Sep 16, 2002
filing date -
Sep 18, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for designing an Application Specific Integrated Circuit (ASIC) structure on a semiconductor substrate, includes (a) defining a class of circuit designs, the class having a common design part shared within the class and a custom design part variable for individual designs in the class, (b) allocating a set of bottom layers and a set of top metal layers to implement the common design part, the allocated sets of bottom layers and top metal layers having a fixed pattern for the class, and (c) implementing the custom design part using metal layers above the allocated set of bottom layers and below the allocated set of top metal layers. The method may further includes characterizing the ASIC for the common design and using the fixed patterns of the allocated set of bottom layers and the allocated set of top metal layers.
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