Method for preparing a polymer for chemical mechanical polishing
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United States of America Patent
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Nov 23, 2004
Grant Date -
Feb 20, 2003
app pub date -
Aug 14, 2002
filing date -
Nov 29, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to a method for preparing a polymer for chemical mechanical polishing of a semiconductor substrate. The method comprises providing a thermoplastic foam substrate and exposing the substrate to an initial plasma reactant to produce a modified surface thereon. The method also includes exposing the modified surface to a secondary plasma reactant to create a grafted surface on the modified surface. An electrode temperature is maintained between about 20.degree. C. and about 100.degree. C. during the exposures of the substrate and the modified surface.
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