Method of laser machining materials with minimal thermal loading
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United States of America Patent
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Nov 23, 2004
Issued Date -
N/A
app pub date -
Apr 10, 2002
filing date -
Apr 10, 2002
priority date (Note) -
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Abstract
A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.
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