Method and apparatus for mounting semiconductor chips onto a flexible substrate
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United States of America Patent
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Nov 23, 2004
Grant Date -
Jan 3, 2002
app pub date -
Jul 2, 2001
filing date -
Jul 3, 2000
priority date (Note) -
Expired
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Abstract
The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.
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