Apparatus for molding with hot melt adhesives
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United States of America Patent
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Nov 23, 2004
Grant Date -
Jan 29, 2004
app pub date -
Jul 23, 2002
filing date -
Jul 23, 2002
priority date (Note) -
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Abstract
This invention consists of a new cost effective injection molding apparatus for molding with hot melt adhesives and other Polyamide materials. Manufactured from standard tubing components in a double 'L' or 'C' design, it has fewer moving parts than other molding machines therefore requiring less maintenance. It is specifically designed to not require the use of temperature limiting and maintenance prone heated hoses for transport of melted material or sliding injection nozzles for engagement into mold-set by utilizing a substantially fixed injection nozzle. It incorporates a sell-draining melt reservoir with single-side mounting to allow for heat expansion and has very short material transfer distance from reservoir to mold-set. It can utilize permanent nozzle engagement into the mold-set to simplify molding operation and reduce cost. It incorporates several safety features to protect operators against injuries.
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