Apparatus for the transport and equipping of substrates with semiconductor chips
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United States of America Patent
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Nov 23, 2004
Grant Date -
Jan 30, 2003
app pub date -
Jul 29, 2002
filing date -
Jul 30, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.
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