Circuit board with lead frame
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United States of America Patent
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Nov 16, 2004
Grant Date -
Sep 18, 2003
app pub date -
Feb 6, 2003
filing date -
Feb 7, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a circuit board of the present invention, a lead frame includes an electrode for mounting an electronic component. The lead frame is encapsulated in a resin portion. The lead frame includes a step portion exposed from a surface of the resin portion so that the electrode is formed. Accordingly, not only lead type electronic components but also surface mount type electronic components can be mounted on the surface of the circuit board. Therefore, because the electronic components can be concentrated, the lead frame circuit board can be miniaturized.
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