Thermal management with filled polymeric polishing pads and applications therefor
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United States of America Patent
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Nov 16, 2004
Grant Date -
Feb 13, 2003
app pub date -
Mar 4, 2002
filing date -
Jun 1, 2001
priority date (Note) -
Expired
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Abstract
The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-mechanical planarization, the resulting heat conductive pad and a polishing apparatus that includes the pad. The pad includes a polishing body composed of a thermoconductive polymer comprising an substrate and filler particle containing a Group II salt and within the substrate.
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