Electronic package with strengthened conductive pad
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United States of America Patent
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Nov 9, 2004
Grant Date -
Sep 23, 2004
app pub date -
Apr 28, 2003
filing date -
Mar 20, 2003
priority date (Note) -
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Abstract
An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile pressure of about 1.4 grams per square mil or greater.
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