Method for forming plating film and electronic component having plating film formed theron by same method
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United States of America Patent
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Nov 2, 2004
Grant Date -
Jan 2, 2003
app pub date -
Jun 25, 2002
filing date -
Jun 27, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
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