Method and apparatus for dispensing solder on a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 2, 2004
Issued Date -
N/A
app pub date -
Feb 27, 2003
filing date -
Mar 8, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully