Flexible printed wiring board and its production method
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United States of America Patent
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Oct 26, 2004
Grant Date -
N/A
app pub date -
Jan 2, 2002
filing date -
Aug 13, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a flexible printed wiring board obtained by connecting metal bumps of a first flexible printed wiring part and connection pads of a second flexible printed wiring part, the first flexible printed wiring part is composed of a conductive layer and insulating layer adjacent thereto, holes A being provided in the insulating layer so as to reach the conductive layer, metal plugs being formed in these holes by an electrolytic plating method, metal bumps being produced by making the tips of these metal plugs project from the insulating layer. In this way, as many as possible flexible printed wiring boards can be obtained from a laminated sheet for flexible printed wiring of prescribed size.
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